Glass Core
Replaces conventional plastic cores with glass to realize large-area, high-performance package substrates.
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Plastic Core - Existing
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Glass Core - JWMT
TGV (Through-Glass Via)
High-performance semiconductor packaging increasingly demands glass substrates with superior electrical and mechanical properties.
TGV technology forms ultra-fine through-holes in glass substrates, optimizing signal transmission and
power distribution while delivering low signal loss and exceptional flatness,making it ideal for applications in HPC, AI, 5G, and autonomous driving.
JWMT leverages laser-modified phase transformation and chemical etching — instead of direct drilling — to minimize micro-cracks,
enhance efficiency, and deliver advanced TGV solutions.
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Materials
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Glass
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JWMT's Technology
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Substrates for Glass Core / Glass Interposer
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Packaging
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Chip
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Module
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Server
Application
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Data center
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Cloud
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Autonomous driving
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AI
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AR/AV
Glass Interposer
Replaces conventional silicon interposers with glass to realize large-area, low-cost interposers.
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Si Interposer - Existing
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Glass Interposer - JWMT
Glass Cavity
Implements through/blind cavities to embed passive components inside glass substrates.
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Through Cavity
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Blind Cavity
TGV Foundry
JWMT is ready to provide TGV foundry services tailored to customer requirements.
- TGV
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Hole / Cavity
- Plating
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Cu fulfill
- CMP
- IC Substrate / IDM / OSAT
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Glass Core / Glass Interposer